Vertical heat treatment device for semiconductor

Details Vertical heat treatment device for semiconductor Vertical heat treatment device for semiconductor

1993-12-16

1996-02-27

Fourson, George

Coating apparatus

Gas or vapor deposition

Work support

118725, 118500, C23C 1600, B05C 1300, B05C 1302, B05C 2100

Patent

active

054945240

ABSTRACT:
End members are located at the top and the bottom of a vertical heat treatment device. A plurality of support members are vertically mounted on the end members. A plurality of wafer hold members are fixed on the support members in a parallel manner, each of which is formed in an approximately circular arc shape. The wafer hold member is made of SiC by a CVD method or Si3N4 by a CVD method. The wafer hold member has a plate portion on which a wafer is to be placed and a reinforce portion connected to the plate portion. The plate portion is 100-1000 microns in thickness.

REFERENCES:
patent: 4781511 (1988-11-01), Harada et al.
Ohmine et al., European Patent Application No. 0,448,346 A1, filed on Mar. 19, 1991.
Japanese Utility Model, Laid-Open No. 62-128633, Filed on Feb. 7, 1986.

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