Thick film copper via-fill inks

Details Thick film copper via-fill inks Thick film copper via-fill inks

1986-10-02

1989-03-07

Barr, Josephine

Compositions

Electrically conductive or emissive compositions

Free metal containing

106 113, 106 20, 501 69, 501 73, 501 77, H01B 106

Patent

active

048104205

ABSTRACT:
An improved copper via-fill ink for forming post-ups in a thick dielectric layer separating two patterned layers of copper conductor in a multilayer circuit assembly is provided. The via-fill ink comprises copper powder, a suitable organic vehicle and a glass frit consisting of a devitrifying glass and a vitreous glass. The devitrifying glass is a zinc-magnesium-barium-aluminum-zirconium-phosphosilicate glass and the vitreous glass is a barium-calcium-borosilicate glass.

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