Thick film resistor paste and resistors therefrom

Details Thick film resistor paste and resistors therefrom Thick film resistor paste and resistors therefrom

1979-07-09

1982-01-26

Kyle, Deborah L.

Compositions

Electrically conductive or emissive compositions

Free metal containing

252518, 252519, 106 114, 427125, 4271262, 428446, 428702, 338308, H01B 102

Patent

active

043127703

ABSTRACT:
This invention relates to resistor compositions comprising, in % by weight, about 5-24% RuO.sub.2, about 10-20% Ag, about 3-8% Sb.sub.2 O.sub.3, about 8-12% CdO, about 35 to 70% lead-borosilicate glass, up to about 4% Ta.sub.2 O.sub.5 and up to about 2% thermistor powder such as at least one of the transition metals Mn.sub.2 O.sub.3, NiO, CuO, Cr.sub.2 O.sub.3 and ZnO. These resistor compositions are adapted to be dispersed in a liquid vehicle to form a resistor ink or paste that can be applied to a surface of a ceramic substrate and fired to form a resistor having stable electrical and mechanical properties.

REFERENCES:
patent: 3304199 (1967-02-01), Faber et al.
patent: 3352797 (1967-11-01), Kim
patent: 3553109 (1971-01-01), Hoffman
patent: 3560410 (1971-02-01), Schubert
patent: 3583931 (1971-06-01), Bouchard
patent: 3928243 (1975-12-01), Kudza et al.

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