Method of bonding tab inner lead and bonding tool

Details Method of bonding tab inner lead and bonding tool Method of bonding tab inner lead and bonding tool

1992-03-27

1994-02-22

Heinrich, Samuel M.

Metal fusion bonding

Process

Using high frequency vibratory energy

2281791, 22818021, H01L 21607

Patent

active

052880060

ABSTRACT:
A bonding tool having a round pointed end smaller than the bonding pad for the semiconductor element is urged with a bonding force F.sub.1 and pressed down into the inner lead of a TAB tape such that the bonding tool end and inner lead come in close contact with each other. Then, the bonding force F.sub.1 applied to the tool is reduced to F.sub.2, while at the same time ultrasonic vibration 17 is applied to the tool, thus effecting bonding of the inner lead to the bonding pad with applied heat and pressure. Unlike the prior art, no bump has to be formed on the bonding pad for the semiconductor element or on an end of the inner lead. It is thus possible to simplify the bonding process and also to reduce the cost of bonding. Further, a highly reliable bond can be realized without causing crack or other damage to the pad structure.

REFERENCES:
patent: 3387365 (1968-06-01), Stelmak
patent: 3391451 (1968-07-01), Moore
patent: 3459610 (1969-08-01), Dijkers et al.
patent: 3607580 (1971-09-01), Obeda
patent: 3683105 (1972-08-01), Shamash et al.
patent: 4189825 (1980-02-01), Robillard et al.
patent: 4776509 (1988-10-01), Pitts et al.
IBM Technical Disclosure Bulletin; J. C. Edwards "No Bump Beam Tape"; vol. 25, No. 4, Sep. 1982, pp. 1948-1949.

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