Multilayer wiring substrate

Details Multilayer wiring substrate Multilayer wiring substrate

1987-09-08

1989-03-28

Lesmes, George F.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428137, 428209, 428428, 428432, 428901, 156 89, 174685, B32B 300, B32B 1500, C03B 2900

Patent

active

048163236

ABSTRACT:
A multilayer wiring substrate is disclosed. The wiring substrate is provided with a substrate section made of a ceramic material. A plurality of power-supply wiring layers are formed within the substrate section. Additionally, a plurality of first and second through-holes penetrate the substrate section. Formed on a wall surface of the section to define each of the first through-holes are first electrically conductive metal layers, each of which is connected electrically to at least one of the power supply wiring layers. Formed on a wall surface of the section to define each of the second through-holes are coating layers of a fluoride resin dielectric. Second electrically conductive metal layers are formed on the coating layers, respectively. There is also provided a circuit supplied with power via the first electrically conductive metal layers and with signals via the second electrically conductive metal layers.
There is further disclosed a method of manufacturing a multilayer wiring substrate.

REFERENCES:
patent: 4652970 (1987-03-01), Watari et al.

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