Method of wire bonding with applied insulative coating

Details Method of wire bonding with applied insulative coating Method of wire bonding with applied insulative coating

1984-10-24

1987-07-07

Ramsey, Kenneth J.

Metal fusion bonding

Process

Combined

228179, 228203, 29850, H01L 2160

Patent

active

046781145

ABSTRACT:
The invention provides a bonding wire which prevents electric short-circuiting even if it comes into contact with another bonding wire, a bonding method using the same, and a semiconductor device including the same. The bonding wire comprises a core wire made of a metal and an insulating film which surrounds it. The insulating film is eliminated from the ends of the bonding wire by thermal decomposition and scattering, while simultaneously each end of the bonding wire is connected to a bonding pad of the semiconductor device or to a lead frame. In the semiconductor device, the bonding pads are respectively connected to lead frames by means of the bonding wires.

REFERENCES:
patent: 3646367 (1972-02-01), Hazel
patent: 3673681 (1972-07-01), Steranko
patent: 4002282 (1977-01-01), Murdoch
patent: 4013212 (1977-03-01), Miller
patent: 4098447 (1978-07-01), Edson et al.
patent: 4488674 (1984-12-01), Egawa et al.

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