1988-11-29
1991-05-14
Hille, Rolf
357 40, 357 41, H01L 2710, H01L 2715
Patent
active
050160800
ABSTRACT:
The present invention covers a semiconductor wafer for semi-custom use in which there are no scribe lines in at least one direction. Electrically isolated cells are provided throughout the wafer. The scribe lines can thus be arbitrarily placed according to an individual customer's instructions, with the isolated cells near the scribe line being covered with metalization to form a bonding pad. Preferably, scribe lines are provided in one direction, either horizontal or vertical. This allows fixed bonding pads to be placed near these scribe lines and allows special components, such as power transistors and ESD protection systems to be placed near the fixed bonding pads. This provides better silicon efficiency than the embodiment with no fixed scribe lines by simplifying the routing. The components which need to be near the bonding pads are placed there, rather than being located randomly throughout the wafer. The customer can then specify a length of a cell which has a fixed height.
REFERENCES:
patent: 4413271 (1983-11-01), Gontowski et al.
patent: 4479088 (1984-10-01), Stopper
patent: 4682202 (1987-07-01), Tanizawa
patent: 4733288 (1988-03-01), Sato
patent: 4829014 (1989-05-01), Yerman
patent: 4835592 (1989-05-01), Zommer
Article "Exar Drives Down the Cost of Arrays", Electronics, No 5, Sep. 1988, Hasbrouck Heights, N.J.
Exar Corporation
Hille Rolf
Tran Minhloan
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