Compound semiconductor substrate with InGaP layer

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357 4, 357 30, 357 34, 357 22, H01L 29161

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050160656

ABSTRACT:
Disclosed is a compound semiconductor substrate having a III-V group compound semiconductor layer on a IV group substrate, which has substantially no residual stress and few crystalline defects. The substrate is formed from (a) a IV group substrate, (b) a first III-V group compound semiconductor layer formed on the substrate, (c) a second compound semiconductor layer having such a lattice constant as to produce a stress in a direction opposite to the stress which occurs during the time of forming said first semiconductor layer due to a difference of thermal expansion coefficient between said substrate and said first semiconductor layer, formed on said first semiconductor layer, and (d) a third III-IV group compound semiconductor layer similar to the first semiconductor layer, formed on said second semiconductor layer.

REFERENCES:
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Chyi et al., "Molecular Beam Epitaxial Growth and Characterization of InSb on Si", Appl. Phys, Lett., 54(11), 13 Mar. 1989, pp. 1016-1018.
"High-Quality GaInAsP/InP Heterostructures Grown by Metalorganic Chemical Vapor Deposition on Silicon Substrates", Appl. Phys. Lett., 52(3), 18 Jan. 1988, pp. 209-211.
Razeghi et al., "First Room-Temperature CW Operation of a GaInAsP/InP Light-Emitting Diode on A Silicon Substrate", Appl. Phys. Lett., 53(10), 5 Sep. 1988, pp. 854-856.
Seki et al., "Epitaxial Growth of InP . . . ", J. of Crystal Growth, vol. 93, Nos. 1-4, 1988, pp. 527-531.
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