High temperature thermal insulation material and method for maki

Details High temperature thermal insulation material and method for maki High temperature thermal insulation material and method for maki

1980-07-14

1982-03-23

Weinblatt, Mayer

Compositions

Electrolytes for electrical devices

264 292, 264 291, 428902, 4283122, 501 82, 501 95, C04B 4300

Patent

active

043211542

ABSTRACT:
A thermal insulation material at high temperature comprising insulating mineral fibres bonded in a matrix, wherein the mineral fibres have a melting point higher than 1.000.degree. C. and represent 15 to 60% of the weight of the material, and wherein the matrix is formed, at least in part, by pyrolytic carbon which represents 18 to 40% of the weight of the material. A method for making such a material comprises dispersing a carbon-containing material such as a resin made of fibrous reinforcement, shaping by moulding the mixture thus obtained and pyrolysis of the carbon-containing material.

REFERENCES:
Chemical Abstracts, vol. 87, 1977-188353r, p. 236 Columbus, Ohio (U.S.).
Yutina et al., "Heat-Insulation Paper and Cardboard from Refractory Fiber" Ogneupory, vol. 18, No. 8, pp. 6-9, Aug. 1977.

Affiliated with

Also associated with

Rating

High temperature thermal insulation material and method for maki does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High temperature thermal insulation material and method for maki, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High temperature thermal insulation material and method for maki will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1649919