Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...
Patent
1996-06-10
1998-07-21
Cain, Edward J.
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
At least one aryl ring which is part of a fused or bridged...
524440, C08K 308
Patent
active
057836213
ABSTRACT:
A method is described for determining high performing anti-bleed agents by comparing the structural characteristics of a compound to specified ranges of structurally-based variables. These structurally-based variables are determined by first comparing the structural characteristics of the best performing anti-bleed agents in a first set of computer simulations of anti-bleed agent candidates in a die attach adhesive on a substrate. The effects of other anti-bleed agent candidates are determined by plotting the structurally-based variables against modeled bleed. Predictive ranges are determined by the performance groups of the candidates with the coincidentally lowest bleed. Also disclosed are organic-based formulations suitable for assembling semiconductor devices including die attach adhesive useful for bonding a semiconductor device to a substrate that incorporates selected anti-bleed agents and which may additionally contain a filler.
REFERENCES:
patent: 5150195 (1992-09-01), Nguyen
patent: 5155066 (1992-10-01), Nguyen
patent: 5195299 (1993-03-01), Nguyen
patent: 5250600 (1993-10-01), Nguyen et al.
patent: 5371178 (1994-12-01), Nguyen
patent: 5386000 (1995-01-01), Nguyen
patent: 5399907 (1995-03-01), Nguyen
Michael R. Marks et al., "An Experimental Study of Die Attach Polymer Bleedout in Ceramic Packages", Thin Solid Films, 1994, pp. 54-60.
P.G. de Gennes, "The Dynamics of Wetting", pp. 173-179.
"Describing the System", Discover, May 1994, pp. 2-1 to 2-5.
"Forcefields", Discover, May 1994, pp. 3-1 to 3-9.
Lieng-Haung Lee, "Roles of Molecular Interactions in Adhesion, Adsorption, contact Angle and Wettability", presented to the American Chemical Society Symposium on Adhesion, Contact Angle and Wettability, San Francisco, California, Apr. 1992, pp. 583-634.
J.E. Ireland, "Epoxy Bleedout in Ceramic Chip Carriers", Feb. 1982, International J. Hybrid, 4 pages.
M.L. White, "The Removal of Die Bond Epoxy Bleed Material by Oxygen Plasma", 32nd ECC Conti May 10-12, 1982, San Diego, California, pp. 262-265.
Iwamoto Nancy E.
Pedigo Jesse L.
Cain Edward J.
Johnson Matthey Inc.
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