Process of defining film patterns on microelectronic substrates

Details Process of defining film patterns on microelectronic substrates Process of defining film patterns on microelectronic substrates

1979-06-06

1980-11-04

Smith, John D.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

51310, 51311, 51312, 51319, 156645, 156656, 427108, 427348, 427349, 427259, 427272, 427273, 427282, 427270, 427355, 430318, B05D 512, B24B 104

Patent

active

042320593

ABSTRACT:
A process is disclosed for delineating a patterned electroconductive coating on a substantially nonconductive substrate. The process can be used on substrates having a thickness in excess of 50 microinches. The process involves forming a substantially continuous electroconductive film on a substrate. An air abrasive resistant continuous mask film of metallic material is applied to the electroconductive film and etched to form masked and unmasked portions of the electroconductive film corresponding to the desired patterned coating. The unmasked portions of the electroconductive film are removed to leave the masked portions of the electroconductive film remaining on the substrate. The mask film can then be removed from the electroconductive film resulting in the desired pattern delineated in the electroconductive film on the substrate or the mask can remain in place and be used to form an integral part of the device formed with the substrate.

REFERENCES:
patent: 3210214 (1965-10-01), Smith
patent: 3240624 (1966-03-01), Beck
patent: 3419425 (1968-12-01), Conrad
patent: 3873361 (1975-03-01), Franco et al.
patent: 4020535 (1977-05-01), Cuneo et al.
patent: 4027323 (1977-05-01), Lorenze et al.
patent: 4047286 (1977-09-01), Lob et al.

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