Semiconductor device

Details Semiconductor device Semiconductor device

1998-08-31

2000-11-07

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257737, 257738, 257778, 257780, 257786, 257777, 257773, 257690, 257691, 257692, 257697, 257730, H01L 2348

Patent

active

061440914

ABSTRACT:
A semiconductor device comprising a plurality of bump electrodes wherein signal pins requiring electrical connection are assigned in sequence from the bump electrodes at the outermost periphery near the edge of the semiconductor device to the bump electrodes in an interior area of the semiconductor device, and no-connection pins requiring no electrical connection are assigned to the remaining bump electrodes, is provided. Circuit board cost is thus reduced, and the ease of mounting the semiconductor device to the circuit board is improved.

REFERENCES:
patent: 5834844 (1998-11-01), Akagawa et al.
patent: 5859474 (1999-01-01), Dordi
patent: 5909055 (1999-06-01), Yamashita et al.

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