Plastic foil for hot leaf stamping and method for forming

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156233, 156239, 156247, B44C 100

Patent

active

057830177

ABSTRACT:
A plastic foil for hot leaf stamping includes a layer of metal having a thickness in the range of 20 millimicrons to 100 millimicrons, a lacquer coating having a thickness in the range of 0.5 microns to 3 microns and a heat activatible adhesive. The metal layer lacquer coating and heat activatible adhesive are caused to be adhered to the substrate forming the final article during a stamping operation which releases said metal layer, lacquer coating and heat activatible adhesive from a plastic carrier film to which had initially been applied. Methods for forming such foil and for forming a decoration image on a substrate using such foil are also provided.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Plastic foil for hot leaf stamping and method for forming does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Plastic foil for hot leaf stamping and method for forming, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plastic foil for hot leaf stamping and method for forming will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1643395

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.