Lamination of apertured or non-apertured three-dimensional films

Details Lamination of apertured or non-apertured three-dimensional films Lamination of apertured or non-apertured three-dimensional films

1996-09-03

1998-07-21

Crispino, Richard

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156285, 156292, 1563099, 156322, B32B 328, B32B 3114

Patent

active

057830142

ABSTRACT:
The present invention provides an improved method for laminating a first three-dimensional apertured or non-apertured film material to a second flat or three-dimensional apertured or non-apertured film material utilizing the heat generated by the extrusion of the first and/or second materials and the films produced thereby.

REFERENCES:
patent: 3033723 (1962-08-01), Mead
patent: 3142599 (1964-07-01), Chavannes
patent: 3231454 (1966-01-01), Williams
patent: 3628720 (1971-12-01), Schmedding
patent: 3868285 (1975-02-01), Troy
patent: 3940529 (1976-02-01), Hepford et al.
patent: 4412879 (1983-11-01), Ottaviano
patent: 4518643 (1985-05-01), Francis
patent: 4555811 (1985-12-01), Shimalla
patent: 4629643 (1986-12-01), Curro et al.
patent: 4657625 (1987-04-01), Kawakami
patent: 4891258 (1990-01-01), Fahrenkrug
patent: 4894265 (1990-01-01), Chang et al.
patent: 4895749 (1990-01-01), Rose
patent: 4995930 (1991-02-01), Merz et al.
patent: 5158819 (1992-10-01), Goodman, Jr. et al.
International Search Report in PCT/US95/09829 corresp. to U.S. application No. 08/286,475, filed on Aug. 5, 1994.

Affiliated with

Also associated with

Rating

Lamination of apertured or non-apertured three-dimensional films does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Lamination of apertured or non-apertured three-dimensional films, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lamination of apertured or non-apertured three-dimensional films will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1643385