System and method for reinforcing a bond pad

Details System and method for reinforcing a bond pad System and method for reinforcing a bond pad

1997-04-30

2000-11-07

Zimmerman, John J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Including variation in thickness

428164, 428209, 257773, H01L 2352

Patent

active

061433969

ABSTRACT:
The reinforcing system (10, 70, 90) for a bond pad (12, 72, 92) includes at least one dielectric layer or stack (20, 21, 22, 76, 78, 96, 98) disposed under the bond pad (12, 72, 92). A reinforcing patterned structure (30, 80, 82, 100, 102) is disposed in the dielectric layer or stack (20, 21, 22, 76, 78, 96, 98).

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