Universal interconnection substrate

Details Universal interconnection substrate Universal interconnection substrate

1982-11-29

1984-07-03

Kucia, R. R.

Electricity: electrical systems and devices

Miscellaneous

174 685, 357 2, 357 45, 361410, 361416, H05K 118

Patent

active

044582978

ABSTRACT:
Disclosed is a wafer substrate for integrated circuits (1) which by itself may be made either of conductive or non-conductive material. This substrate carries two planes or layers of patterned metal (19, 20), thus providing two principal levels of interconnection. An insulation layer (21) is placed between the metal layers and also between the lower metal layer and the substrate if the latter is conductive. Connections between the metal layers or between the metal layer and the substrate can be made through via holes in the insulator layer or layers, respectively.
The real estate provided by the substrate (1) is divided up into special areas used for inner cells (2) outer cells (3) signal hookup areas (4) and power hookup areas (5). The cells are intended to host the integrated circuit chips (24, 25) and to provide the bonding pads (8) for the signal connections between the chips and the substrate.

REFERENCES:
patent: 3312871 (1967-04-01), Seki et al.
patent: 3445823 (1969-05-01), Petersen
patent: 3558992 (1971-01-01), Huener et al.
patent: 3777221 (1973-12-01), Tatsuko
patent: 3803483 (1974-04-01), McMahon
patent: 3981070 (1976-09-01), Buelow et al.
patent: 4234888 (1980-11-01), Calhoun
patent: 4295182 (1981-10-01), Aubusson et al.
patent: 4364044 (1982-12-01), Kusano

Affiliated with

Also associated with

Rating

Universal interconnection substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Universal interconnection substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Universal interconnection substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1633402