Soldering method using soldering flux and soldering paste

Details Soldering method using soldering flux and soldering paste Soldering method using soldering flux and soldering paste

1999-04-13

2000-11-07

Ryan, Patrick

Metal fusion bonding

Process

With protecting of work or filler or applying flux

228223, 228 24, B23K 3102

Patent

active

061423637

ABSTRACT:
Provided are a soldering flux or paste containing an organic substance which has at least two hydroxyl (--OH) groups in a molecule and of which the temperature at which the mass % becomes approximately 0% is not lower than approximately 170.degree. C. and not lower than the solid phase linear temperature of the solder, as measured by thermal gravimetry in which a flow rate of an air or nitrogen (N.sub.2) gas atmosphere is 200 ml/min and a rate of temperature rise is 10.degree. C./min, and a soldering method using the same. The soldering flux or paste of the present invention gives good wettability to a matrix to be bonded in a normal temperature profile and in a non-reductive atmosphere without leaving any residue.

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