Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1993-03-30
1994-05-31
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361688, 361704, 361749, 257710, 257714, 174 65R, 165185, H05K 720
Patent
active
053174780
ABSTRACT:
A hermetically sealed electronics package in which an electronic element located on a support is hermetically sealed using a cover comprising the top layer of a multilayer flexprint or a separate flexprint. The top layer of the flexprint or the separate flexprint is supported above the electronic element by a frame structure. When the cover comprises the top flexprint layer, the top layer is only partially bonded to the underlying flexprint during fabrication of the package. After circuit placement, the flap portion of the top flexprint layer is bonded to the flexprint to provide hermetic sealing of the underlying electronic elements. The frame structure provides support for the flexprint cover to prevent deformation of the cover and resulting damage to the underlying circuit. A cooling system is also disclosed for use in combination with the hermetic seal configuration to provide an electronic package which is protected from both contaminants and built-up heat.
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patent: 4597617 (1986-07-01), Enochs
patent: 4695870 (1987-09-01), Patraw
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patent: 5041943 (1991-08-01), Ilardi et al.
patent: 5065281 (1991-11-01), Hernandez
patent: 5070936 (1991-12-01), Carroll et al.
Denson-Low W. K.
Hughes Aircraft Company
Lachman M. E.
Picard Leo P.
Sales M. W.
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