Method of minimizing lateral shrinkage in a co-fired, ceramic-on

Details Method of minimizing lateral shrinkage in a co-fired, ceramic-on Method of minimizing lateral shrinkage in a co-fired, ceramic-on

1991-12-18

1994-01-11

Silbaugh, Jan H.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156320, 156325, B32B 1800, C04B 3700

Patent

active

052777243

ABSTRACT:
A method of fabricating a multi-layered, co-fired, ceramic-on-metal circuit board utilizes a bonding layer of glass. The glass has a coefficient of thermal expansion not greater than that of the metal base. The glass of the bonding layer has a softening point below that of the glass in the multi-layer ceramic so that the glass of the bonding layer flows and bonds to the metal to minimize the lateral shrinkage of the multi-layered ceramic.

REFERENCES:
patent: 4291107 (1981-09-01), Barry et al.
patent: 4801488 (1989-01-01), Smith
patent: 4930857 (1990-06-01), Acarlar
patent: 4952531 (1990-08-01), Cherukuri
patent: 5013360 (1991-05-01), Finkelstein et al.
patent: 5041695 (1991-08-01), Olenick et al.
patent: 5043222 (1991-08-01), Cherukuri
patent: 5044074 (1991-09-01), Hadwiger et al.
patent: 5047371 (1991-09-01), Cherukuri

Affiliated with

Also associated with

Rating

Method of minimizing lateral shrinkage in a co-fired, ceramic-on does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of minimizing lateral shrinkage in a co-fired, ceramic-on, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of minimizing lateral shrinkage in a co-fired, ceramic-on will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1628456