Method for manufacturing electrically isolated polyimide coated

Details Method for manufacturing electrically isolated polyimide coated Method for manufacturing electrically isolated polyimide coated

1992-11-17

1994-05-31

Chaudhuri, Olik

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

29 2501, C23C 2600

Patent

active

053167872

ABSTRACT:
A method and system for manufacturing electrically isolated vias in a flexible substrate composed of a metal core laminated by layers of an organic material. The method includes the steps of etching via holes, hydrolyzing the inner organic surfaces of the via holes and baking a polyimide solution coated in the via holes.

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McBride, "Multilayer Flexible Film Module", IBM Technical Disclosure Bulletin, vol. 26, No. 12, May 1984, pp. 6637.

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