Heat sink for electrical circuit components

Details Heat sink for electrical circuit components Heat sink for electrical circuit components

1992-12-09

1994-05-31

Davis, Jr., Albert W.

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

16510432, 16510433, 361699, H01L 23473

Patent

active

053160770

ABSTRACT:
A heat sink for electrical circuit components includes a chill plate which is formed by a front plate and a back plate. The front and back plates are interconnected and cooperate to define passages for liquid coolant. Cooling fins extend from the back plate and are exposed to the atmosphere to conduct heat from the back plate. A pump is mounted on the chill plate and induces a flow of the cooling medium through passages between the front and back plates. An expansion chamber is also disposed between the front and back plates and holds gas which is compressible by the liquid cooling medium to accommodate expansion of the liquid cooling medium.

REFERENCES:
patent: 3327776 (1967-06-01), Butt
patent: 3481393 (1969-12-01), Chu
patent: 3817321 (1974-06-01), von Cube et al.
patent: 3965971 (1976-06-01), Roggenkamp
patent: 4468717 (1984-08-01), Mathias et al.
patent: 4519447 (1985-05-01), Wiech, Jr.
patent: 4620216 (1986-10-01), Horvath
patent: 4847731 (1989-07-01), Smolley
patent: 4884168 (1989-11-01), August et al.
patent: 4941530 (1990-07-01), Crowe

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