Semiconductor layer with optical communication between chips dis

Details Semiconductor layer with optical communication between chips dis Semiconductor layer with optical communication between chips dis

1984-01-16

1991-04-23

Ullah, Akm

357 19, G02B 612, H01L 3112

Patent

active

050094769

ABSTRACT:
The disclosure relates to a complex circuit composed of a circuit board which is formed of crystalline elemental silicon in the form of a slice and circuit component in the form of semiconductor integrated circuits thereon which are preferably formed of a Group III-V compound. Signals from each of the integrated circuits are transmitted to other integrated circuits on the board or externally of the board either by conventional printed conductors on the board or, preferably, by means of a laser formed in each integrated circuit at each output terminal thereon which transmits light signals along light conducting members in the silicon board to photo responsive elements at the input locations on other ones of the integrated circuits on the board for external to the board. The light signal is transferred from an integrated circuit output to an integrated circuit input or to a device external to the board by means of light conducting members. These light conducting members may be light conducting rods positioned either on the surface of the board or in grooves formed therein. Alternatively, the light conducting members can be silicon dioxide paths formed in the silicon circuit board by selective oxidation of the silicon board to form silicon dioxide light conducting paths therein. Each light conducting path is coupled between a light emitting output from an integrated circuit and a light receiving input of another integrated circuit or travels to the edge of the circuit board for transmission external of the board.

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