Device for the electrolytic treatment of plate-shaped workpieces

Chemistry: electrical and wave energy – Apparatus – Electrolytic

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

204237, 204275, 204277, C25D 1700

Patent

active

058274103

DESCRIPTION:

BRIEF SUMMARY
BACKGROUND OF THE INVENTION

The present invention generally relates to methods and apparatus for electrolytically treating workpieces. More particularly, it relates to a new and improved apparatus for electrolytic treatment of planar workpieces, such as printed circuit boards, wherein the workpieces are conveyed in an upright verticle orientation through a treatment cell and a verticle flow of bath liquid in the treatment cell is redirected toward the major surfaces of the planar workpieces for improved ion exchange.
EP-A-0 421 127 discloses an apparatus for treating printed circuit boards wherein the individual printed circuit boards are continuously conducted through successively arranged treatment baths in vertically suspended attitude on a horizontal conveying path. The conveying of the printed circuit boards through the treatment baths accommodated in treatment cells ensues via clamps arranged at endlessly circulating drives, these clamps also simultaneously assuming the cathodic contacting of the printed circuit boards in the case of an electrodeposition. Vertical slots for the passage of the printed circuit boards are located in the end walls of the treatment cells, whereby seals fashioned as brush seals or strip brush seals are provided in the passage region. The individual treatment cells are arranged in collecting tanks from which the collected bath liquid is continuously returned into the allocated treatment cells with the assistance of appropriate pumps. The return of bath liquid into a treatment cell thereby ensues via an admission connected to the appertaining pump at the pressure side whose opening lies in an end wall under the vertical slot for the passage of the printed circuit boards and is horizontally directed into the treatment cell. The bath liquid that flows in should thereby be uniformly distributed onto both sides of the printed circuit boards.
US-A-4,401,522 discloses a similarly constructed apparatus for the electrolytic treatment of workpieces such as, for example, printed circuit boards, wherein vertically arranged roller pairs are allocated as seals to the vertical slots in the end walls of the treatment cells. The return of bath liquid into a treatment cell here ensues via two rows of vertically directed spray types arranged at both sides of the conveying path that are each respectively provided with a series of spray openings in longitudinal direction that are directed onto the workpieces. The supply of the spray pipes ensues via a distribution chamber fashioned in the floor region of the treatment cell that is in turn supplied with bath solution from the collecting tank via the pump.
JP 60-13096 A (in Patents Abstracts of Japan, C-283, Vol. 9/No. 125) discloses an apparatus for the electroylytic treatment of printed circuit boards that comprises a treatment cell for the acceptance of the treatment bath, two insoluble anodes arranged at a spacing from one another in the treatment cell, and a pump for the circulation of the bath liquid. The cathodically contacted printed circuit boards are suspended centrally from above between the two anodes, whereby the bath liquid circulated with the pump is introduced into the treatment cell from above at both sides of the printed circuit board. Ladder-shaped inserts with horizontally proceeding rails are additionally suspended into the treatment cell at both sides of the printed circuit board, whereby the inserts are moved parallel to the plane of the printed circuit board and thereby increase the turbulence of the bath liquid flowing from top to bottom at both sides of the printed circuit board.


SUMMARY OF THE INVENTION

The present invention provides a new and improved apparatus for the electrolytic treatment of vertically aligned, plate-shaped workpieces wherein the workpiece surfaces are effectively contacted with bath liquid to provide an improved ion exchange at the workpiece surfaces, as the workpieces are conveyed through treatment cells.
More particularly, in an embodiment, a new and improved apparatus for electrolytic treatm

REFERENCES:
patent: 4155815 (1979-05-01), Francis et al.
patent: 4372825 (1983-02-01), Eidschun
patent: 4401522 (1983-08-01), Buschow et al.
patent: 4883575 (1989-11-01), Yasuno et al.
patent: 4986888 (1991-01-01), Hosten et al.
Patent Abstracts of Japan (C-283 May 30, 1985 Vol. 9/No. 125); JP 60-13096 (A); Jan. 23, 1985; pp. 511-514.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Device for the electrolytic treatment of plate-shaped workpieces does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Device for the electrolytic treatment of plate-shaped workpieces, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Device for the electrolytic treatment of plate-shaped workpieces will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1611391

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.