Semiconductor device

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357 233, 357 239, 357 42, 357 43, 357 67, 357 71, H01L 2978

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active

047696869

ABSTRACT:
Herein disclosed is a semiconductor device, especially, an MISFET which can ensure a high breakdown voltage and operate at a high speed. The semiconductor device according to the present invention reduces the sheet resistance by using an impurity region, which has an impurity concentration not exceeding 10.sup.20 cm.sup.-3, in a drain or source region and by forming a metal silicide layer on the surface of the impurity region. Moreover, the semiconductor device of the present invention is constructed such that the impurity concentration of an n-type drain or source region does not exceed 10.sup.20 cm.sup.-3 whereas the impurity concentration of a p-type drain or source region does not exceed 10.sup.19 cm.sup.-3 and such that at least one portion of the drain or source region is made of a metal silicide so that it can effectively protect the latch-up phenomenon which is caused when two or more semiconductor devices of different conductive type are integrated.

REFERENCES:
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patent: 4005450 (1977-01-01), Yoshida et al.
patent: 4141022 (1979-02-01), Sigg et al.
patent: 4339869 (1982-07-01), Reihl et al.
patent: 4374700 (1983-02-01), Scott et al.
patent: 4384301 (1983-05-01), Tasch, Jr. et al.
patent: 4458410 (1984-07-01), Sugaki et al.
IBM Tech. Dis. Bul., vol. 23, No. 12, May 1981, Critchlow et al. pp. 5355.
IBM Tech. Dis. Bul., vol. 24, No. 1A, Jun. 1981, Jambotkar pp. 57-60.
Okabe, "A Complimentary-Pair of High Power Mosfets" 1977 IEDM pp. 416-419.
Rodriguez et al., "Fabrication of Short Channel . . ." Solid State Electronics 1976, vol. 19, No. 1 pp. 17-21.

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