Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1998-12-28
2000-05-02
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361760, 361773, 361783, 361808, 257696, 174 521, 174 522, 310340, 310348, H05K 702, H01L 41053
Patent
active
060580208
ABSTRACT:
A component housing for surface mounting of a semiconductor component on a component-mounting surface of a printed circuit board. The component housing including a chip carrier made of an electrically insulating material and having an approximately planar chip carrier area, a semiconductor chip, preferably having an integrated electronic circuit, secured on the chip carrier area, and electrode terminals having a surface-mountable configuration. The electrode terminals penetrating through the chip carrier and electrically connected to the semiconductor chip. A distance between the component-mounting surface of the printed circuit board and outer delimiting areas of the chip carrier which face the component-mounting surface of the printed circuit board increases continuously from an edge region to a central region of the chip carrier.
REFERENCES:
patent: 4330683 (1982-05-01), Parker
patent: 4985807 (1991-01-01), De Mari
patent: 5157480 (1992-10-01), McShane et al.
patent: 5185550 (1993-02-01), Morita et al.
patent: 5273440 (1993-12-01), Ashman et al.
patent: 5586010 (1996-12-01), Murtuza et al.
"High Density Chip Carrier With Protected Leads", IBM Technical Disclosure Bulletin, vol. 31, No. 2, Jul. 1988.
Beer Gottfried
Stadler Bernd
Winterer Jurgen
Greenberg Laurence A.
Lerner Herbert L.
Picard Leo P.
Siemens Aktiengesellschaft
Stemer Werner H.
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