Semi-conductor laser apparatus with support and soldering means

Details Semi-conductor laser apparatus with support and soldering means Semi-conductor laser apparatus with support and soldering means

1981-04-30

1983-09-06

James, Andrew J.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 17, 357 30, 357 81, 174 5062, 350 9620, 350 9621, H01L 2302, H01L 2312, H01L 3300

Patent

active

044032439

ABSTRACT:
The present invention extends the service life of a semi-conductor laser element by bonding a light transmitting member for transmitting the output light from said laser element to a support member for said transmitting member with soft metal solder to improve hermetic sealing therebetween. The beam diameter of the output light generated by said semi-conductor laser element is not substantially changed when passing through the transmitting member since said bonding is conducted at a temperature not causing deformation by softening of said light transmitting member that could cause formation of a distortion therein. The surfacial precision of said light transmitting member also is improved by selecting the thermal expansion coefficient of the material constituting said light transmitting member to be approximately equal to that of said support member. Therefore, the invention provides a semi-conductor laser apparatus applicable in equipment requiring a high resolution.

REFERENCES:
patent: 2788381 (1957-04-01), Baldwin
patent: 3233111 (1966-02-01), Pike
patent: 3281606 (1966-10-01), Lueck
patent: 3482198 (1969-12-01), Hooper
patent: 3500099 (1970-03-01), Taylor
patent: 3584265 (1971-06-01), Nier
patent: 3816847 (1974-06-01), Nagao
patent: 4076955 (1978-02-01), Gates
patent: 4131911 (1978-12-01), Fujine et al.
patent: 4168883 (1979-09-01), Macleod
patent: 4338577 (1982-07-01), Sato et al.

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