Metal working – Method of mechanical manufacture – Electrical device making
Patent
1982-04-01
1984-10-23
Goldberg, Howard N.
Metal working
Method of mechanical manufacture
Electrical device making
29840, H05K 330
Patent
active
044779704
ABSTRACT:
A method for preparing a printed circuit board for mounting of surface mounted RF components such that the lead inductance of the components is minimized. The process consists of producing plated through apertures in the printed circuit board to create a component body hole with lead contacts extending to the edge of the component body hole. The resulting aperture is then blanked to remove portions of the metal lining to provide electrical isolation between the lead contacts while maintaining lead contacts that extend to the edge of the component body hole. A component is then soldered into position such that solder is wicked through the plated through apertures to create solder contact of the leads at the edge of the component body hole. This results in substantial reduction in lead inductance improving RF amplifier gain and stability and improving bandwidth characteristics.
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Alexander Robert P.
Dauksch Stephen F.
Pichia Robert J.
Arbes Carl J.
Gillman James W.
Goldberg Howard N.
Motorola Inc.
Motsinger F. John
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