Heat pipe

Details Heat pipe Heat pipe

1986-03-13

1987-09-29

James, Andrew J.

357 81, H01L 2346, H01L 2336, H01L 2314

Patent

active

046972056

ABSTRACT:
A semiconductor circuit construction in which the semiconductor junction is constructed as an integral part of a heat pipe to eliminate the casing which interferes with heat flow. The semiconductor chip material directly forms one wall of the casing of a heat pipe which is constructed as a hollow wafer-like configuration. A special material formed from a mixture of glass and the semiconductor material and which is directly adjacent to the backside of the semiconductor chip is used as the heat pipe wick.

REFERENCES:
patent: 3229759 (1966-01-01), Grover
patent: 3413239 (1968-11-01), Olstowski
patent: 4082863 (1978-04-01), Dancy et al.
patent: 4322737 (1982-03-01), Sliwa, Jr.
patent: 4327399 (1982-04-01), Sasaki et al.
patent: 4372377 (1983-02-01), Morris

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