Socket for integrated circuit package with extended leads

Details Socket for integrated circuit package with extended leads Socket for integrated circuit package with extended leads

1981-03-27

1983-09-06

Abercrombie, Willie G.

Geometrical instruments

339 75MP, H05K 104

Patent

active

044025610

ABSTRACT:
A socket for connecting an integrated circuit package to a printed circuit board or the like wherein the connection between the circuit board and the semiconductor chip is as short as possible. This is accomplished by providing a straight line conductor between the integrated circuit package and the printed circuit board. In accordance with one embodiment, a contact in the form of a movable double ended sharp needle is employed to connect the lead from the package to the lead on a substrate. In order to provide the force mating the leads and the intermediate needle, external force is provided by a spring structure comprising a multi-fingered element with the tips of the fingers encapsulated in plastic or other compliant membrane separating the spring member and the leads of the package.

REFERENCES:
patent: 3192307 (1965-06-01), Lazar
patent: 3663921 (1972-05-01), Richard
patent: 3757271 (1973-09-01), Judge et al.
patent: 4164003 (1979-08-01), Cutchaw
patent: 4330163 (1982-05-01), Aikens et al.
patent: 4346952 (1982-08-01), Bright et al.

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