Apparatus for shaping liquid portions of solder in soft solderin

Details Apparatus for shaping liquid portions of solder in soft solderin Apparatus for shaping liquid portions of solder in soft solderin

1997-12-23

2000-05-02

Ryan, Patrick

Metal fusion bonding

Including means to apply flux or filler to work or applicator

228 51, 228 151, 228 55, B23K 100, B23K 3700, B23K 302

Patent

active

06056184&

ABSTRACT:
The apparatus, in preparation of soft soldering semiconductor chips to a substrate (6), is for the shaping of spherically domed liquid portions of solder (8) into flat solder applications (8"), as evenly distributed as possible and correctly positioned on the substrate. On a shaft (10) which can be lifted and lowered, a punch (20) with a punch surface (22) is guided vertically, spring mounted and slewable all around the axis of motion (16) and also frictionally engaged. The punch (20) is provided with distance keeping means--e.g. in the form of a circumferential rim (24)--which extends beyond the punch surface (22) and is intended for touching down on the substrate (6). In each operation cycle the punch (20) is automatically aligned to the substrate (6). Since the punch (20) is self-adjusting with respect to the shaft (10), it is unnecessary to maintain an exactly defined height position above the substrate.

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XP002035203 (in IBM Technical Disclosure Bulletin, vol. 19, No. 9, dated Feb. 1997 by R. G. Christensen & F. P. Koverda).

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