Alignment method and a projection exposure apparatus using the s

Optics: measuring and testing – By shade or color – With sample responsive to plural colors applied simultaneously

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356400, G01B 2753

Patent

active

049520601

ABSTRACT:
A projection exposure apparatus is disclosed for exposing a semiconductor wafer to a pattern, formed on a reticle, by projection using a projection lens system. The apparatus includes an alignment optical system disposed at a side of the wafer remote from the projection lens system. The alignment optical system is used to detect an alignment mark provided on the wafer, from the back of the wafer. In accordance with the detection, the wafer is moved so that its alignment mark is brought into a predetermined positional relation with the alignment optical system, whereby the reticle and the wafer are relatively aligned. With this arrangement, the wafer alignment mark can be detected without being adversely affected by a resist layer applied to the wafer surface. Thus, the reticle and the wafer can be aligned very accurately.

REFERENCES:
patent: 3752589 (1973-08-01), Kobayashi
patent: 4385838 (1983-05-01), Nokazawa et al.
patent: 4573791 (1986-03-01), Phillips
patent: 4629313 (1986-12-01), Tanimoto
patent: 4699515 (1987-10-01), Tamimoto et al.

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