Method for deposition on a semiconductor wafer

Details Method for deposition on a semiconductor wafer Method for deposition on a semiconductor wafer

1983-09-30

1984-12-04

Smith, John D.

Coating processes

Electrical product produced

Condenser or capacitor

118500, 427 94, 427 95, H01L 21316, H01L 2168

Patent

active

044864655

ABSTRACT:
A nitride-coated boat is used in a method for depositing phosphosilicate glass (PSG) on semiconductor wafers. Because stainless steel is the material typically used for the boat for PSG deposition, the linear coefficient of thermal expansion of the boat is significantly greater than that of PSG. Consequently, cooling the boat after PSG deposition tends to cause flaking of PSG from the boat. The nitride-coating on the boat buffers the contraction differential between the PSG and stainless steel to significantly reduce flaking of PSG.

REFERENCES:
patent: 4098923 (1978-07-01), Alberti
patent: 4389967 (1983-06-01), Shimoda
Alliegro, "Diffusion Furnace Paddle", Western Electric Technical Digest, No. 22, Apr. 1971.

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