Selective plating of dielectric substrates

Details Selective plating of dielectric substrates Selective plating of dielectric substrates

1983-08-04

1984-12-04

Valentine, Donald R.

Chemistry: electrical and wave energy

Processes and products

204 181, 204 20, 204 30, 204 38B, C25D 502, C25D 554, C25D 534

Patent

active

044862733

ABSTRACT:
Process for the maskless electroplating of selective areas of a dielectric substrate comprising depositing an electroconductive film on the surface, evaporating a narrow band of the film off the surface to expose a narrow strip of substrate surrounding a zone of the film where electroplating is unwanted, immersing the substrate in an electroplating bath opposite an appropriate anode, and cathodizing only that portion of the film that covers the region sought to be plated. In one embodiment a laser beam is used to selectively evaporate electroless copper from the surface of an ABS substrate.

REFERENCES:
patent: 3122449 (1964-02-01), Swanson
patent: 3668003 (1972-06-01), Furness
patent: 3676213 (1972-07-01), Marton
patent: 3874075 (1975-04-01), Lohse
patent: 3915809 (1975-10-01), Wheatley
patent: 4016050 (1977-04-01), Lesh et al.

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