Metal treatment – Compositions – Heat treating
Patent
1980-12-29
1983-11-15
Roy, Upendra
Metal treatment
Compositions
Heat treating
29576B, 29578, 148175, 148187, 357 34, 357 91, H01L 2122, H01L 2131
Patent
active
044153716
ABSTRACT:
An array of hundreds of devices may be simultaneously processed on a chip to sub-micron dimensions by establishing tiny active regions for each transistor surrounded by field oxide filled motes or slotted regions, wherein the slots are utilized to dope the substrate within the action region. The N type substrate is double energy boron planted through one surface to establish a P region to a given depth. This surface is oxidized and photoresist masked conventionally to open regions for the slots which are ion milled or ODE etched to a given depth. N+ regions are established by the slots by ion implanting at an angle such that the entire depth of the slot is not doped but rather the doping is confined to a region within the double energy P implanted depth. Drive-in diffusion enlarges the N+ areas for the emitter and collecter and oxidation fills the mote insulating regions around the active area.
The oxide is stripped and the P region enhanced to P+ at the surface, with silox being deposited and opened for metal contacts to the P+ region for the base and the emitter and collector regions. The doping profile of the base region provides a potential barrier to minimize the flow of electrons toward the surface because the emitter electrons are channeled through the less heavily doped part of the base region to the collector.
REFERENCES:
patent: 4047975 (1977-09-01), Widman
patent: 4140558 (1979-02-01), Murphy et al.
patent: 4211582 (1980-07-01), Horng et al.
patent: 4264382 (1981-04-01), Anantha et al.
patent: 4309812 (1982-01-01), Horng et al.
patent: 4318751 (1982-03-01), Horng
patent: 4339767 (1982-07-01), Horng et al.
Berndlmaier et al. IBM-TDB, 22 (1980) 4543.
Brack et al. IBM-TDB, 16 (1974) 3287.
Caldwell Wilfred G.
Hamann H. Fredrick
Rockwell International Corporation
Roy Upendra
LandOfFree
Method of making sub-micron dimensioned NPN lateral transistor does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of making sub-micron dimensioned NPN lateral transistor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making sub-micron dimensioned NPN lateral transistor will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-158006