NPN Type lateral transistor separated from substrate by O.D.E. f

Metal working – Method of mechanical manufacture – Assembling or joining

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29571, 29578, 29580, 357 20, 357 50, 357 55, 148 15, 156647, 156662, H01L 2906, H01L 2176

Patent

active

044855516

ABSTRACT:
The invention provides a unique sub-micron dimensioned NPN type transistor and method of making the same, wherein hundreds of such transistors may be fabricated on a single chip with each transistor comprising an active region surrounded by field oxide completely isolating it from the substrate and its effects on operation. Spaced apart slots made in the substrate permit the introduction of orientation dependent etching fluid therein to at least substantially etch semi-arrays of active regions of the substrate away from the substrate except for spaced apart supports therealong. Oxidation serves to support the semi-arrays and subsequent steps directly from the substrate or by webs of oxidation along the tops of the semi-arrays connected to the substrate. The support is necessary while orthogonal slots are provided permitting access to opposed sides of the active regions for doping n+ from each end, which n+ is driven in from both sides to provide an n+p n+ emitter base collector transistor active region to which electrical connections are applied using conventional techniques providing almost complete reduction of the parasitic capacitances and resistances because of the total oxide isolation of the active regions from the substrate.

REFERENCES:
patent: 3598664 (1971-08-01), Kilby
patent: 4005451 (1977-01-01), Martinelli et al.
patent: 4047975 (1977-09-01), Widmann
patent: 4109272 (1978-08-01), Herbst et al.
patent: 4178197 (1979-12-01), Marinace
patent: 4196440 (1980-04-01), Anantha et al.
patent: 4259680 (1981-03-01), Lepselter et al.
Fay et al; "Optical Alignment System for Sub-Micron X-Ray Lithography", J. Vac. Sci. Tech. 16 (6), Nov./Dec. 1979, pp. 1954-1958.
Nelson et al; "A Wide-Range Alignment System for X-Ray Lithography", J. Vac. Sci. Tech. 19 (4), Nov./Dec. 1981, pp. 121-123.
Tsumita et al, "Fabrication of X-Ray Masks Using Anisotropic Etching of (110) Si and Shadowing Techniques," Proc. 16th Symp. Elec. Ion & Photon Beam Tech., May 1981, pp. 1211-1213.
Elliott et al; "Size Effects in E-Beam Fabricated MOS Devices"; IEEE Trans. Elec. Dev., vol. Ed-26, No. 4, Apr. 1979, pp. 469-475.
Broers et al, "Electron-Beam Fabrication of 80-A Metal Structures", Appl. Phys. Lett.; vol. 29, No. 9, Nov. 1, 1976, pp. 596-598.
Seliger et al, "High-Resolution Ion-Beam Processes for Microstructure Fabrication", J. Vac. Sci. Tech., 16 (6) Nov./Dec. 1979, pp. 1610-1612.
Flanders; "X-Ray Lithography at Approximately 100 .ANG. Line Widths using X-Ray Masks Fabricated by Shadowing Techniques", J. Vac. Sci. Tech., 16 (6), Nov./Dec. 1979, pp. 1615-1619.
Evans et al, "A 1-.mu.m Bipolar VLSl Technology"; IEEE Trans. on Elec. Dev.; vol. Ed-27, No. 8, Aug. 1980; pp. 1373-1379.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

NPN Type lateral transistor separated from substrate by O.D.E. f does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with NPN Type lateral transistor separated from substrate by O.D.E. f, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and NPN Type lateral transistor separated from substrate by O.D.E. f will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1576188

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.