Method for effecting solder interconnects

Details Method for effecting solder interconnects Method for effecting solder interconnects

1988-11-02

1989-12-26

Seidel, Richard K.

Metal fusion bonding

Process

Plural joints

228203, 228248, B23K 120, B23K 3100

Patent

active

048892750

ABSTRACT:
A method for effecting high density solder interconnects between a substrate and at least one metalized film having through holes therein is provided. Solder is first applied to metalized portions of the substrates and the solder is then subject to a reflow process to provide reflowed solder. Pressure is applied to the reflowed solder during a second reflow process to provide prestressed or shaped solder. The metalized film is then positioned with at least one metalized portion adjacent to the shaped solder. Heat, as from a laser, is directed through the through holes in the film to melt the solder and form solder interconnections between the substrate and the metalized film.

REFERENCES:
patent: 3589591 (1971-06-01), Schwenn
patent: 3713575 (1973-01-01), Cushman
patent: 3926360 (1975-12-01), Moister, Jr.
patent: 4319708 (1982-03-01), Lomerson
patent: 4412642 (1983-11-01), Fisher, Jr.
patent: 4562637 (1986-01-01), Kushima et al.
patent: 4661192 (1987-04-01), McShane
patent: 4752027 (1988-06-01), Gschwend
IBM Technical Disclosure Bulletin, "Simultaneous Laser-Assisted Solder Reflow on Double-Sided . . . Carriers", vol. 31, No. 6, pp. 7-9, Nov. 1988.

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