Excavating
Patent
1993-03-26
1995-04-25
Voeltz, Emanuel T.
Excavating
371221, 371 23, G06F 1100
Patent
active
054105528
ABSTRACT:
Disclosed is a method and apparatus for generating a test sequence to test a fault in a digital circuit. According to this method and apparatus, when a fault propagation process for a fault, for which a test sequence is generated is not successful, at least a segment of a path to propagate the effects of the fault is memorized as illegal information., And the fault propagation process is restarted for the same fault without selecting the illegal information. Hence, the chance of a successful fault propagation process is increased, which leads to the improvement of the fault coverage. In addition, according to the apparatus and method, it is detected whether a state transition goes into a loop (i.e., two identical states exist) in the state initialization process and then the process is restarted by defining the state caused the loop as an illegal state. Hence, the chance of a successful state initialization process is increased, which leads to the improvement of the fault coverage.
REFERENCES:
patent: 4204633 (1980-05-01), Goel
patent: 4696006 (1987-09-01), Kawai
patent: 4937826 (1990-06-01), Gheewala et al.
patent: 4996689 (1991-02-01), Samad
Fault Tolerant Computing: Theory and Techniques, vol. I, Chapterl, 1.4.2, issued by Prentice-Hall, Englewood Cliff, N.J., 1986.
Hitec: A Test Generation Package for Sequential Circuits, by T. Niermann et al., as a refernece of European Design Automation Conference in 1991.
Matsushita Electric - Industrial Co., Ltd.
Voeltz Emanuel T.
Wachsman Hal D.
LandOfFree
Method and apparatus for generating test sequence does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for generating test sequence, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for generating test sequence will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1573014