Method for fabricating a switching device by anodization

Details Method for fabricating a switching device by anodization Method for fabricating a switching device by anodization

1995-07-07

1997-08-12

Gorgos, Kathryn L.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Controlling current distribution within bath

205106, 205122, 205124, C25D 1102, H01L 21316

Patent

active

056561474

ABSTRACT:
When an anodized film is to be formed, one formation-voltage input point is used. An interconnecting ring for anodization is provided between the input point and a pattern to be anodized. The interconnecting ring is in contact with and encloses the pattern. Another interconnecting ring to which the formation-voltage input point is connected is provided around the interconnecting ring. In addition, two junction points are provided at vertically symmetric positions with respect to the pattern. The junction points are connected to the interconnecting ring. The junction points are connected to upper connection terminals and lower connection terminals of the pattern by respective thin-line groups including a plurality of thin lines. The formation voltages at respective input points at the upper connection terminals and the lower connection terminals of the pattern are made equal to each other.

REFERENCES:
patent: 3640854 (1972-02-01), Klein
patent: 4203087 (1980-05-01), Kovac et al.
patent: 4469568 (1984-09-01), Kato et al.
patent: 5352907 (1994-10-01), Matsuda et al.

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