Self-aligned Bi-CMOS device having high operation speed and high

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437 34, 437 56, 437 57, 148DIG9, 357 34, 357 42, 357 43, H01L 2100, H01L 2102, H01L 2122, H01L 2126

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049578740

ABSTRACT:
A Bi-CMOS device comprises a first insulating layer formed on a principal surface of a semiconductor substrate to extend outwardly from an edge portion of a base region of a bipolar transistor and from an edge portion of each source/drain region of each MOS transistor. A first polycrystalline semiconductor layer is formed on and in contact with a surface area of the base region of the bipolar transistor and a surface area of each source/drain region of each MOS transistor so as to extend on the first insulating layer. A second insulating layer is formed to cover the first polycrystalline semiconductor layer, a base-emitter junction exposed at the principal surface of the substrate and a portion of each of the base region and the emitter region adjacent to the exposed base-emitter junction. The second insulating layer also covers an inside edge of each source/drain region of the MOS transistors, and portions of each source/drain region and a channel region adjacent to the inside edge. A second polycrystalline semiconductor layer is formed to cover a gate insulator of each MOS transistors and a portion of an emitter region of the bipolar transistor in contact with the emitter region, so as to extend on the second insulating layer.

REFERENCES:
patent: 4806499 (1989-02-01), Shiohara
patent: 4825275 (1989-04-01), Tomassetti
Kobayashi, Y., Biplar CMOS-Merged Technology for High-Speed 1-Mbit DRAM, IEEE Transact. on Elect. Devices, vol. 36, No. 4, Apr. 1989, pp. 706-711.
IBM Tech. Dis. Bull., Bipolar Device Incorporated into CMOS Technology; vol. 28, No. 9, Feb. 1986, pp. 3813-3815.
O, K., BiCMOS Process Utilizing Selective Epitoxy for Analog/Digital Applications, IEEE Trans. on Elect. Devices, vol. 36, No. 7, Jul. 1989, pp. 1362-1369.

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