Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1994-06-16
1995-04-25
Tolin, Gerald P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
174252, 257713, 361705, H05K 720
Patent
active
054104491
ABSTRACT:
A method is provided for improving the integrity of a solder joint between a large surface-mounted integrated circuit component and a circuit board substrate. In particular, the strength of the solder joint is promoted by preventing the formation of voids in the solder joint during a reflow soldering process by which the component is secured to the circuit board. The method relies on the geometry of the conductor pad used to provide electrical contact between the component and the remaining circuitry and thermal contact between the component and the substrate. The conductor pad is composed of a number of platforms which are defined by a network of trenches that provides numerous passages through which the solder and flux gases may flow during the soldering process. The platforms serve as sites on which the solder compound can be selectively deposited in a manner that further enhances the soldering process, such that voids within the solder joint are substantially avoided.
REFERENCES:
patent: 4158745 (1979-06-01), Keller
patent: 4449165 (1984-05-01), Kaufman
patent: 4700273 (1987-10-01), Kaufman
patent: 5088007 (1992-02-01), Missele
patent: 5168348 (1992-12-01), Chu
patent: 5258887 (1993-11-01), Fortune
patent: 5287001 (1994-02-01), Buchmann
Delco Electronics Corp.
Navarre Mark A.
Tolin Gerald P.
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