Thermoplastic resin composition

Details Thermoplastic resin composition Thermoplastic resin composition

1994-02-23

1995-04-25

Marquis, Melvyn I.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525537, C08L 5300, C08L 2308, C08L 8102

Patent

active

054099960

ABSTRACT:
A thermoplastic resin composition comprising (a) 50-99% by weight of a polyarylenesulfide resin and (b) 50-1% by weight of a norbornene-type resin as essential components is disclosed. This resin composition possesses excellent stiffness properties and high heat resistance, and exhibits only small anisotropic properties and superior moldability during the molding operation, and is useful for molding various electronic parts, household electric or electronic parts and articles. Those having a Vicut softening point of 200.degree. C. or higher are especially useful for sealing electronic parts or photo-semiconductors.

REFERENCES:
patent: 5164469 (1992-11-01), Goto et al.
patent: 5218048 (1993-06-01), Abe et al.
patent: 5292789 (1994-03-01), Ishida et al.
Patent Abstract of JP 2075662; Mar. 15, 1990 Resin Compsns. For Sealing Electronic Parts-Contain Poly (Phenylene Sulfide) Resin, Fibrous Reinforcer Other Inorganic Filler, Organic Silane And Bis (Fatty Acid Amide), etc.

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