Thermally enhanced molded cavity package having a parallel lid

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

257710, 361705, H05K 720

Patent

active

056509154

ABSTRACT:
The present invention provides a thermally enhanced molded cavity package (10) having a package body (12) with upper (40) and lower (42) sections. The package body (12) has a cavity (22) with the cavity opening (32) in the upper section (40) of the package body (12). The present package (10) includes a lead frame (14) with a plurality of individual leads (16) that are external to the cavity (22) and a plurality of lead fingers (28) that are internal to the cavity (22). The present package (10) also includes a heat spreader (34) for increasing heat dissipation from the package (10) in the lower section (42) of the package body (12) and coupled to the lead frame (14). The heat spreader (34) has a first surface (26) forming a floor of the cavity upon which a microcircuit chip (24) may be mounted and a second surface forming a base (36) of the package body (12). The upper section (40) of the package body (12) includes a lid seat (33) for supporting a lid (30) and for maintaining the lid (30) parallel to the floor (26) of the cavity when the lid (30) is placed in the cavity opening (32).

REFERENCES:
patent: 4099200 (1978-07-01), Koutalides
patent: 4890152 (1989-12-01), Hirata
patent: 5261157 (1993-11-01), Chang
patent: 5264393 (1993-11-01), Tamara
patent: 5293301 (1994-03-01), Tanaka
patent: 5379187 (1995-01-01), Lee
patent: 5444909 (1995-08-01), Mehr
patent: 5471011 (1995-11-01), Maslakow

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