Thermally activated clamping apparatus and component part and me

Details Thermally activated clamping apparatus and component part and me Thermally activated clamping apparatus and component part and me

1995-11-22

1997-07-22

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257727, H05K 720

Patent

active

056509138

ABSTRACT:
A surface mountable component (110) is urged toward a substrate (102) during a bonding operation. The apparatus consists of a thermally activated clamping device (TACD) (300) having alloys with differing relative deflection-temperature characteristics. When exposed to elevated temperatures, the thermally activated clamping device (300) deforms a predetermined amount depending upon the heat-energy applied to the thermally activated clamping device (300). This allows for a mounting bracket that applies a force on a component (110) in proportion to an amount of heat-energy applied to the mounting bracket. In addition, the thermally activated clamping device (300) is coupled locally to the substrate in an area surrounding the component which eliminates the need for long, fragile mounting brackets. The method consists of utilizing the relative deflection-temperature characteristics of metals to clamp a component (110) during a bonding operation.

REFERENCES:
patent: 5132873 (1992-07-01), Nelson et al.

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