Abrading – Abrading process – With tool treating or forming
Patent
1995-09-29
1997-08-12
Smith, James G.
Abrading
Abrading process
With tool treating or forming
451 41, 451443, 451444, B24B 100
Patent
active
056559518
ABSTRACT:
The present invention is a method for selectively reconditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafers. A desired polishing rate is selected based upon a set of operating parameters for a specific wafer. The set of operating parameters may be different from those of previously planarized wafers. A desired change in the thickness of the pad material is estimated for reconditioning the pad to achieve a desired polishing rate. The estimate of the desired change in pad thickness is based upon the desired polishing rate and a predetermined correlation between wafer polishing rates and changes in pad thickness per conditioning cycle. A layer of material having a thickness substantially equal to the desired change in thickness is then removed from the planarizing surface to create a new planarizing surface.
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Marty Lucky F.
Meikle Scott G.
Edwards Dona C.
Micro)n Technology, Inc.
Smith James G.
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