Method and apparatus for polishing a semiconductor substrate waf

Details Method and apparatus for polishing a semiconductor substrate waf Method and apparatus for polishing a semiconductor substrate waf

1996-03-05

1997-11-18

Breneman, R. Bruce

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

1566361, 1566451, 216 88, 451 41, 451 72, B24B 700

Patent

active

056883609

ABSTRACT:
A semiconductor wafer polishing apparatus includes a housing and a turntable mounted in the housing. The turntable has an axis of rotation and a surface for affixing a semiconductor wafer. The polishing apparatus also includes a motor mounted to the housing and connected to the turntable to supply a torque for rotating the turntable about the axis of rotation. A polishing assembly is connected to the housing and extends adjacent to the turntable surface. A polishing pad is affixed to the polishing assembly and is positionable to contact the semiconductor wafer. Some polishing pads are cylindrical in form. Other polishing pads have a conical form.

REFERENCES:
patent: 3549439 (1970-12-01), Kaveggia et al.
patent: 3857123 (1974-12-01), Walsh
patent: 5547417 (1996-08-01), Breivogel et al.

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