Method of making a mounting base pad for semiconductor devices

Details Method of making a mounting base pad for semiconductor devices Method of making a mounting base pad for semiconductor devices

1984-06-27

1987-05-19

Czaja, Donald E.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156257, 156297, 165185, 174138G, 174 16HS, B32B 3118, F28F 700, H01B 1904

Patent

active

046665455

ABSTRACT:
A mounting pad means for use in combination with solid-state semiconductive translating devices and including a base pad with flange walls extending from said base pad, and with device mounting pad means being secured to the surface of the base pad and comprising a thin layer of silicone base rubber. The base pad and flange walls are formed of a generally rigid laminate with a core having outer metal foil layers disposed on opposite surfaces thereof, and wherein the core is composed of a thin layer of silicone base rubber.

REFERENCES:
patent: 3427715 (1969-02-01), Mika
patent: 3673543 (1972-06-01), Garner
patent: 4572757 (1986-02-01), Spadafora
"Silastic RTV" 1961, Dow Corning Corporation.

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