1989-11-02
1991-01-22
Hille, Rolf
357 74, 357 80, 357 25, H01L 2316, H01L 2302, H01L 2312, H01L 3902
Patent
active
049874772
ABSTRACT:
A solid state imaging device has solid-state imaging-device chips each having a picture-element array and bonding pads, chip carriers each having long sides longer than the solid-state imaging-device chip and terminals electrically connected to corresponding bonding pads on the chip, a package board which carries the chip carriers, and external leads provided on the package board and electrically connected to the respective terminals of the chip carriers. In a method of assembling such a solid state imaging device, a plurality of solid-state imaging-device chips are mounted on respective chip carriers, and a plurality of imaging units are formed by electrically connecting the terminals of each chip carrier to the corresponding bonding pads. The imaging units are then arranged on the package board and the terminals of the imaging units are connected to the external leads, respectively. A test is conducted on the solid-state imaging-device chips of each imaging unit, and if a non-conforming chip is found, an imaging unit including the non-conforming chip is removed from the package board and a new imaging unit is secured to the package board in place of the removed chip.
REFERENCES:
patent: 3784884 (1974-01-01), Zoroglu
patent: 4322735 (1982-03-01), Sadamasa et al.
patent: 4712018 (1987-12-01), Stoffel et al.
patent: 4739389 (1988-04-01), Goedbloed
Hille Rolf
Mitsubishi Denki & Kabushiki Kaisha
Ostrowski D. M.
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