Thin film deposition system

Details Thin film deposition system Thin film deposition system

1990-04-24

1991-01-22

Nguyen, Nam X.

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20429809, 20429811, 20429815, 20429823, C23C 1434

Patent

active

049868900

ABSTRACT:
A thin film deposition system for depositing a thin film on a substrate by sputtering is characterized in that a substrate holder for holding thereon the substrate is transferred by a transfer mechanism from or to a film deposition position to or from another position such as another chamber different from the film deposition chamber, an electrode for applying bias voltage of radio frequency to the substrate or substrate holder is axially movable relatively to the substrate holder so that the electrode can be contacted with or discontact from the substrate holder, and a grounded shield is provided so as to cover the electrode and the substrate holder with a gap thereby shielding radio frequency from the electrode and the substrate holder to prevent formation of glow discharge between a wall of the vacuum chamber and the electrode or the substrate holder.

REFERENCES:
patent: 4132624 (1979-01-01), King et al.
patent: 4439261 (1984-03-01), Pavone et al.
patent: 4466877 (1984-08-01), McKelvey
patent: 4581118 (1986-04-01), Class et al.
patent: 4756815 (1988-07-01), Turner et al.

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