Machine for changing the spacing of a plurality of wafers

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Details

214 1R, 214301, B65G 6504

Patent

active

041083237

ABSTRACT:
A machine for changing the spacing of a plurality of wafers comprises a plurality of wafer receiving surfaces initially having a first spacing associated therewith. The wafer receiving surfaces cooperatively engage with means which, when activated, move the plurality of wafer receiving surfaces so that they have a second spacing associated therewith.

REFERENCES:
patent: 3920128 (1975-11-01), Baker
patent: 3949891 (1976-04-01), Butler et al.

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