Mask alignment measurement structure for semiconductor fabricati

Electricity: measuring and testing – Conductor identification or location – Inaccessible

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29574, H01L 2166, G01R 2702

Patent

active

045715386

ABSTRACT:
A method of quantitatively measuring the relative alignment of elements on a surface of a semiconductor body formed by two sequential masking steps during processing is provided. A fixed pattern of rectangular images are formed on a first mask; and a fixed pattern of repeating U-shaped images are formed on a second mask. The semiconductor body is processed so that the rectangular images on the first mask align with the U-shaped images on the second mask. An electrical probe is applied to opposed ends of the boustrophederal pattern formed and the electrical resistance measured to determine a parameter related to the relative alignment of elements on the semiconductor body.

REFERENCES:
patent: 3808527 (1974-04-01), Thomas
patent: 4386459 (1983-06-01), Boulin

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